OGAWA, Tadashi on Twitter: "=> Advanced Packaging, AMD, Case Study, Tutorial, Hot Chips 2021, Aug 22 https://t.co/l8FLvlsTRV https://t.co/q7yFPcQeM9 Chiplet https://t.co/3MJN0CqlCk Milan-X, Nov 8 https://t.co/yj9yNCm9Xp 3D V-cache https://t.co ...
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OGAWA, Tadashi on Twitter: "=> "An Overview of Chiplet Technology for the AMD EPYC and Ryzen Processor Families", Gabriel Loh, Senior Fellow, AMD, IEEE SCV - Industry Spotlight, Aug 24, 2021, (4.6
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OGAWA, Tadashi on Twitter: "=> "Deep Diving Zen 3 V-Cache", Jan 21, 2022 https://t.co/pbQuUSUh8M Latency AMD (Ring topology) vs Intel (Mesh topology) Bandwidth Single thread/ One CCD L1/L2, DDR4: Intel leads over
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thermaltake Toughliquid Ultra 240 Installation Guide - Manuals+
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